JPH0238488Y2 - - Google Patents
Info
- Publication number
- JPH0238488Y2 JPH0238488Y2 JP17213082U JP17213082U JPH0238488Y2 JP H0238488 Y2 JPH0238488 Y2 JP H0238488Y2 JP 17213082 U JP17213082 U JP 17213082U JP 17213082 U JP17213082 U JP 17213082U JP H0238488 Y2 JPH0238488 Y2 JP H0238488Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- surface wave
- wave chip
- aluminum
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 239000011651 chromium Substances 0.000 claims description 7
- 229910001120 nichrome Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 238000010897 surface acoustic wave method Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17213082U JPS5976134U (ja) | 1982-11-12 | 1982-11-12 | 表面波装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17213082U JPS5976134U (ja) | 1982-11-12 | 1982-11-12 | 表面波装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5976134U JPS5976134U (ja) | 1984-05-23 |
| JPH0238488Y2 true JPH0238488Y2 (en]) | 1990-10-17 |
Family
ID=30375286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17213082U Granted JPS5976134U (ja) | 1982-11-12 | 1982-11-12 | 表面波装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5976134U (en]) |
-
1982
- 1982-11-12 JP JP17213082U patent/JPS5976134U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5976134U (ja) | 1984-05-23 |
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